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Exposure-resolved VLEED from the O-Cu(001: bonding dynamics

Sun, C.Q. (1997) Exposure-resolved VLEED from the O-Cu(001: bonding dynamics. Vacuum, 48 (6). pp. 535-541.

Link to Published Version: http://dx.doi.org/10.1016/S0042-207X(97)00007-9
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Abstract

The appraisal of an association of the VLEED technique and the new models for oxygen chemisorption [Vacuum, J. Phys. Chem. Solids, in press] motivated and enabled us to seek physical insight into the dynamics of the O-Cu(001) surface reaction. It is shown that the discrete stages revealed by exposure-resolved VLEED can be quantified and interpreted by the process dominated by three bonding parameters: First, one Goldschmidt-contraction ionic bond forms between the O adsorbate and a Cu atom on the surface accompanying the vacating of the missing row. Second, another contracting ionic bond follows between the O and a Cu in the substrate; as a result, the oxygen buckles into the bulk. Then, the ionic bond angle increases leading to the relaxation, and finally, interaction develops between the non-bonding states of the oxygen and the lone-pair-induced metal dipoles.

Publication Type: Journal Article
Murdoch Affiliation: School of Mathematical and Physical Sciences
Publisher: Elsevier
Copyright: © 1997 Elsevier Science Ltd
URI: http://researchrepository.murdoch.edu.au/id/eprint/36140
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